Wireless LAN Module Product List

Dimension(mm) 21.4x14.0x2.4
Flash ROM 4MB
RAM 512KB
I/F UART, SPI
CPU ARM Cortex M4F
OperationTemp.(℃) -30 to +85
Certification Japan, U.S.A., Canada, (CE)
IEEE Spec IEEE802.11b/g/n
BluetoothⓇ Ver. Not supported
Overview v1.1
DataSheet v1.0
Dimension(mm) 26.9x19.0x2.1
Flash ROM 8MB
RAM 1.2MB
I/F UART, SPI, I2C, I2S, GPIOs
CPU ARM Cortex M33
OperationTemp.(℃) -40 to +85
Certification Japan, U.S.A., Canada, (CE)
IEEE Spec IEEE802.11a/b/g/n/ac/ax
BluetoothⓇ Ver. v5.4
Overview V1.2
DataSheet v1.5
Dimension(mm) 24.0*11.5*2.0
I/F SDIO, PCM
Crystal Yes
OperationTemp.(℃) -30 to +85
Certification Japan, U.S.A., Canada, (CE)
IEEE Spec 802.11 ac/a/b/g/n
BluetoothⓇ Ver. v4.2
Antenna Yes
Overview v1.1
DataSheet v1.1
Dimension(mm) 25.0*15.7*2.1
I/F SDIO 3.0 for Wi-Fi
UART for Bluetooth
Crystal Yes
OperationTemp.(℃) -40 to +85
Certification Japan, U.S.A., Canada, (CE)
IEEE Spec 802.11 a/b/g/n/ac/ax
BluetoothⓇ Ver. v5.4
Antenna Yes
Overview v1.0
DataSheet v1.4

Wireless LAN＋MCU

★ Under Development

Wireless LAN

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Application Development

SDK Information

Supporting Product Launches
Comprehensive Support from Development to Market Entry

TAIYO YUDEN Wireless Module List

Comparison Table of Current Products and Former Products (TAIYO YUDEN Products) [View Here]