WK8887AA1
Wireless Module
Wireless LAN + Bluetooth® Module
Part Number: WK8887AA1
Status: Mass Production
Evaluation Board
WK8887AA1-EVB
Evaluation Board for WLAN module
WK8887AA1 with SDIO interface.
It is necessary to prepare PC
with SDIO I/F.
Evaluation Kit
WK8887AA1-EVK
Host processor (ESPRESSObin) is attached to this kit.
It is not necessary to prepare PC with SDIO I/F.
Key Features
SMD type module.
Compliant with IEEE 802.11 ac/a/b/g/n.
Bluetooth® Core 4.2
Bluetooth® LE
Low standby current (with low power operation)
Transmit data rate : 11/5.5/2/1 Mbps(11b),
54/48/36/24/18/12/9/6 Mbps(11a/g),
150~6.5 Mbps (11n, MCS7~0, HT20/40),
433.3 ~ 7.22 Mbps (11ac MCS9~0, HT80 )
Channel Number : 1 to 13 channel (11bgn),Bluetooth® LE)
Interface : SDIO3.0, PCM
Built-in Diplexer, 2G-PA, 5G-PA, 5G-LNA, OTP, X'tal,
DC/DC Power
Security: TKIP, WEP, AES, CCMP, CMAC,
WAPI, WPA/WPA2(64bit/128bit)
Outline: 24.0 x 11.5 x2.0 (Max) mm
Package: Metal case package
Japan, FCC and ISED certified.
ETSI EN 300 328 / EN301 893 conducted test report available.
RoHS Conformity
for Detail
| Document Name | Version | Date |
|---|
Overview
|
v1.1 | 2023/08/21 |
|
Data Sheet
|
v1.1 | 2023/08/17 |
|
Application Note
|
v1.1 | 2023/08/17 |
|
Evaluation Board manual
|
v1.0 | 2023/08/31 |
|
Evaluation Kit manual
|
v1.0 | 2023/06/26 |
ETSI Test Report
|
v1.0 | 2023/05/12 |
|
FAQ
|
v1.2 | 2026/04/16 |
|
Radio Law FAQ
|
v1.2 | 2026/03/24 |
|
Module CAD Data
|
v1.4 | 2026/04/06 |