BluetoothⓇ Low Energy Module Product List

Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. V6.x
I/F SPI, UART, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M33
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by nRF Connect SDK
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview -
DataSheet -
Feature Basic Module
Dimension(mm) 3.25x8.55x1.0
Bluetooth Ver. V6.x
I/F SPI, UART, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M33
Crystal System Clock：32MHz
DCDC Supported with External L
OperationTemp.(℃) -40 to +105
ANT support Supported by nRF Connect SDK
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview -
DataSheet -
Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. V6.x
I/F TBD
CPU ARM Cortex M33
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by nRF Connect SDK
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview -
DataSheet -
Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. V6.x
I/F TBD
CPU ARM Cortex M33
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by nRF Connect SDK
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview -
DataSheet -
Feature Basic Module
Dimension(mm) 10.0x15.4x2.0
Bluetooth Ver. V5.4
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M33
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by nRF Connect SDK
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview V1.3
DataSheet V1.2
Feature Basic Module
Dimension(mm) 5.1x11.3x1.3
Bluetooth Ver. V5.4
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M33
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by nRF Connect SDK
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 10.0x15.4x2.0
Bluetooth Ver. V5.0
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview V1.3
DataSheet V1.0
Feature Application Embedded(Central & Peripheral)
Dimension(mm) 10.0x15.4x2.0
Bluetooth Ver. v5.0
Soft device S140　v7.0.1
Application Embedded KFEI's Application
I/F USB, UART, SPI
CPU ARM Cortex M4F
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 9.6x12.9x1.3
Bluetooth Ver. V5.0
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal 32MHz
DCDC Not supported
OperationTemp.(℃) -40 to +85
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 5.1x11.3x1.3
Bluetooth Ver. V5.0
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.1
Feature Application Embedded(Central & Peripheral)
Dimension(mm) 5.1x11.3x1.3
Bluetooth Ver. v5.0
Soft device S140　v7.0.1
Application Embedded KFEI's Application
I/F UART
CPU ARM Cortex M4F
Crystal System Clock：32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Overview V1.3
DataSheet V1.2
Feature Basic Module
Dimension(mm) 10.0x15.4x2.0
Bluetooth Ver. V5.2
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview V1.3
DataSheet V1.0
Feature Basic Module
Dimension(mm) 9.6x12.9x1.3
Bluetooth Ver. V5.3
I/F USB, UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal 32MHz
DCDC -
OperationTemp.(℃) -40 to +105
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 5.1x11.3x1.3
Bluetooth Ver. V5.3
I/F UART, SPI, I2C, PDM, NFC-A
CPU ARM Cortex M4F
Crystal 32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.0
Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. V5.0
I/F UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 5.1x11.3x1.3
Bluetooth Ver. V5.0
I/F UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal 32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 3.25x8.55x0.85
Bluetooth Ver. v5.0
I/F UART, SPI, I2C, I2S, PDM, NFC-A
CPU ARM Cortex M4F
Crystal 32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.2
Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. v5.3
I/F USB, UART, SPI, I2C
CPU ARM Cortex M4
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.0
Feature Application Embedded(Peripheral only)
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. v5.1
Soft device S113　v7.2.0
Application Embedded KFEI's Application
I/F UART
CPU ARM Cortex M4F
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +105
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Overview V1.3
DataSheet V1.2
Feature Basic Module
Dimension(mm) 3.25x8.55x1.0
Bluetooth Ver. V5.3
I/F USB, UART, SPI, I2C
CPU ARM Cortex M4
Crystal 32MHz
DCDC Not supported
OperationTemp.(℃) -40 to +105
ANT support Supported by S340 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.1
Feature Application Embedded(Peripheral only)
Dimension(mm) 3.25x8.55x1.00
Bluetooth Ver. v5.1
Soft device S113　v7.2.0
Application Embedded KFEI's Application
I/F UART
CPU ARM Cortex M4F
Crystal System Clock：32MHz
DCDC Not supported
OperationTemp.(℃) -40 to +105
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Overview V1.3
DataSheet -
Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. v5.2
I/F UART, SPI, I2C, PDM
CPU ARM Cortex M4
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.0
Feature Basic Module
Dimension(mm) 3.25x8.55x1.0
Bluetooth Ver. V5.2
I/F UART, SPI, I2C, PDM
CPU ARM Cortex M4
Crystal 32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.0
Feature Basic Module
Dimension(mm) 9.6x12.9x2.0
Bluetooth Ver. v5.0
I/F UART, SPI, I2C, PDM
CPU ARM Cortex M4
Crystal System Clock：32MHz
Sleep Clock：32.768kHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.0
Feature Basic Module
Dimension(mm) 3.25x8.55x1.0
Bluetooth Ver. v5.0
I/F UART, SPI, I2C, PDM
CPU ARM Cortex M4
Crystal 32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution EY1SENSOR-SKT
Overview V1.3
DataSheet V1.1
Feature Basic Module
Dimension(mm) 3.25x8.55x1.0
Bluetooth Ver. v5.2
I/F UART, SPI, I2C
CPU ARM Cortex M4
Crystal 32MHz
DCDC Supported with Internal LC
OperationTemp.(℃) -40 to +85
ANT support Supported by S212 or S332 Softdevice
Certification Japan, U.S.A., Canada, (CE), Bluetooth® Logo
Sensing Evaluate Solution -
Overview V1.3
DataSheet V1.0
★ Under Development
★ Application Enbedded
RAM Flash/NVM

標準

中型

小型

超小型
nRF54L15 256KB 1.5MB  
EC4L15BA1
 
ES4L15BA1
nRF54L10 192KB 1.0MB  
EC4L10BA1
  
nRF54L05 96KB 0.5MB  
EC4L05BA1
  
nRF5340 512KB
for App.
64KB
for Network		 1MB
for App.
256KB
for Network
EB5340BA1
 
EJ5340BA1
 
nRF52840 256KB 1MB
EB2840AA2
ED2840AA2
EJ2840AA2
 
EB2840MA2
 
EJ2840MA2
 
nRF52833 128KB 512KB
EB2833AA2
ED2833AA2
EJ2833AA2
 
nRF52832 64KB 512KB  
EC2832AA2
EJ2832AA2
ES2832AA2
nRF52820 32KB 256KB  
EC2820AA2
 
ES2820AA2
 
EC2820MA2
 
ES2820MA2
nRF52811 24KB 192KB  
EC2811AA2
 
ES2811AA2
nRF52810 24KB 192KB  
EC2810AA2
 
ES2810AA2
nRF52805 24KB 192KB    
ES2805AA2

Wireless Module Quotation Request & Purchase

For quotation requests regarding mass production modules or evaluation kits, please use the forms below.

You can also purchase from online stores.

Application Development

SDK Information

Bluetooth® Low Energy BluetoothⓇ Low Energy Sensing
Evaluation Solution

Realizing a Small-Scale IoT Start

Supporting Product Launches
Comprehensive Support from Development to Market Entry

TAIYO YUDEN Wireless Module List

Comparison Table of Current Products and Former Products (TAIYO YUDEN Products) [View Here]
BLE/WLAN Chip Set Former Products Current Products
BLE nRF54L15   ES4L15BA1
BLE nRF54L15   EC4L15BA1
BLE nRF5340 EYSQBNZUC EB5340BA1
BLE nRF5340   EJ5340BA1
BLE nRF52840 EYSKBNZWB EB2840AA2
BLE nRF52840 EYSKBNUWB-VX EB2840MA2
BLE nRF52840 EYSKDNZWB ED2840AA2
BLE nRF52840 EYSKJNZWB EJ2840AA2
BLE nRF52840 EYSKJNAWB-VX EJ2840MA2
BLE nRF52833 EYSPBNZUA EB2833AA2
BLE nRF52833 EYSPDNZUA ED2833AA2
BLE nRF52833 EYSPJNZUA EJ2833AA2
BLE nRF52832 EYSHCNZWZ EC2832AA2
BLE nRF52832 EYSHJNZWZ EJ2832AA2
BLE nRF52832 EYSHSNZWZ ES2832AA2
BLE nRF52820 EYSRCNZUY EC2820AA2
BLE nRF52820 EYSRSNZUY ES2820AA2
BLE nRF52820   EC2820MA2
BLE nRF52820   ES2820MA2
BLE nRF52811 EYSNCNZWW EC2811AA2
BLE nRF52811 EYSNSNZWW ES2811AA2
BLE nRF52810 EYSLCNZWW EC2810AA2
BLE nRF52810 EYSLSNZWW ES2810AA2
BLE nRF52805   ES2805AA2
WLAN RW612   WKR612AA1
WLAN 88MW320 WYSACVLAY-XZ WKM320AA1
WLAN 88W8887 WYSAGVDXG WK8887AA1