Wireless LAN Modules（Former Products）

WLAN + Bluetooth Combo

Part Number Dimension
(mm)		 I/F Crystal Operaion
Temp.(℃)		 Certification IEEE Spec Bluetooth®
Ver.		 Antenna Evaluation
Board		 Evaluation
Kit		 Overview Data
Report


WYSBHVGXG

(Not Recommend for New Design)

 12.6 x 8.9 x 1.9

SDIO, PCM

Yes

-30 to 85

None

 802.11 ac/a/b/g/n V4.2 No WBSBHVGXG WKSBHVGXG V1.2 V1.3


WYSBHVGXG-Z1

(Not Recommended for New Design)

 12.6 x 8.9 x 1.9

SDIO, PCM

Yes

-30 to 85

None

 802.11 ac/a/b/g/n V4.2 No (Under development) (Under development) - -


WYSAGVDXG

(Not Recommended for New Design)

 24.0 x 11.5 x2.0

SDIO, PCM

Yes

-30 to 85

Japan
U.S.A.
Canada
(CE)

 802.11 ac/a/b/g/n V4.2 Yes WBSAGVDXG WKSAGVDXG V1.2 V1.5


WYSEGVDXG

(Not Recommended for New Design)

 24.0 x 11.5 x2.0

SDIO, PCM

Yes

-30 to 85

Japan
U.S.A.
Canada

 802.11 ac/a/b/g/n V4.2 RF Connector WYSEGVDXG WYSEGVDXG V1.2 V1.5

WLAN + MCU

Part Number Dimension
(mm)		 I/F CPU Operaion
Temp.(℃)		 Certification IEEE Spec Evaluation
Board		 Evaluation
Kit		 Overview Data
Report


WYSACVLAY-XZ

(Not Recommended for New Design)

 21.4 x 14.0 x 2.4

UART
SPI

Cortex-M4F

-30 to 85

Japan
U.S.A.
Canada

 IEEE802.11b/g/n WBSACVLAY-XZ WKSACVLAY-XZ V1.1 V1.0